The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
May. 20, 2011
Jung-pang Huang, Taichung, TW;
Hui-min Huang, Taichung, TW;
Kuan-wei Chuang, Taichung, TW;
Chun-tang Lin, Taichung, TW;
Yih-jenn Jiang, Taichung, TW;
Jung-Pang Huang, Taichung, TW;
Hui-Min Huang, Taichung, TW;
Kuan-Wei Chuang, Taichung, TW;
Chun-Tang Lin, Taichung, TW;
Yih-Jenn Jiang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor package includes: a chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; an encapsulant encapsulating the chip and having opposite first and second surfaces, the first surface being flush with the active surface of the chip; and first and second metal layers formed on the second surface of the encapsulant, thereby providing a rigid support to the overall structure to prevent warpage and facilitating heat dissipation of the overall structure.