Kuan-Wei Chuang

Title: Kuan-Wei Chuang: Innovator in Electronic Packaging

Introduction

Kuan-Wei Chuang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 5 patents. His work focuses on improving the efficiency and reliability of electronic structures and semiconductor packages.

Latest Patents

Chuang's latest patents include an innovative electronic package and a method for fabricating semiconductor packages with an interposer structure. The electronic structure patent describes a design where multiple conductors are placed on one surface of an electronic body, encapsulated by an epoxy molding compound. This design allows for effective heat transfer during the heating process, addressing the issue of non-wetting of solder materials. His method for fabricating semiconductor packages involves cutting a substrate into interposers, encapsulating them, and then placing semiconductor elements on each interposer. This approach ensures that only high-quality interposers are used, minimizing waste.

Career Highlights

Chuang is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has been instrumental in advancing the technology used in electronic devices, making them more efficient and reliable.

Collaborations

Chuang has collaborated with notable colleagues such as Chun-Tang Lin and Jung-Pang Huang. Their combined expertise has contributed to the successful development of innovative solutions in electronic packaging.

Conclusion

Kuan-Wei Chuang is a key figure in the field of electronic packaging, with a focus on enhancing the performance of electronic structures and semiconductor packages. His contributions continue to shape the future of technology in this area.