Cheng-Liang Hsu

Title: Innovations of Cheng-Liang Hsu in Semiconductor Packaging

Introduction

Cheng-Liang Hsu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit through his patented inventions. With a focus on enhancing the functionality and reliability of semiconductor devices, Hsu's work is pivotal in advancing technology.

Latest Patents

Hsu holds a patent for a semiconductor package that features a unique carrier structure. This structure includes multiple package substrates connected by sections, with a functional element and a groove formed on the connecting section. The groove is strategically located between the package substrate and the functional element. This design allows for the accommodation of glue material that may overflow from a cladding layer, preventing contamination of the functional element. His patent exemplifies a practical solution to a common issue in semiconductor packaging.

Career Highlights

Cheng-Liang Hsu is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His role at the company has allowed him to work on cutting-edge technologies and contribute to the development of innovative packaging solutions. Hsu's expertise and dedication have earned him recognition in his field.

Collaborations

Hsu has collaborated with talented coworkers such as Shu-Ting Lai and Chiu-Lien Li. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Cheng-Liang Hsu's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology. His work not only addresses practical challenges but also sets the stage for future developments in the industry.