Cheng-Han Yao

Title: Cheng-Han Yao: Innovator in Semiconductor Packaging

Introduction

Cheng-Han Yao is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit through his patented inventions. His work is particularly relevant in the ever-evolving technology landscape.

Latest Patents

Cheng-Han Yao holds a patent for a semiconductor package. This invention features a carrier structure with multiple package substrates connected by connecting sections. A functional element and a groove are formed on the connecting section, allowing the groove to accommodate glue material that may overflow from a cladding layer. This design prevents contamination of the functional element, enhancing the reliability of semiconductor devices.

Career Highlights

Cheng-Han Yao is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His role at the company has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor packaging.

Collaborations

Cheng-Han Yao collaborates with talented coworkers, including Shu-Ting Lai and Chiu-Lien Li. Their combined expertise fosters an environment of innovation and creativity, leading to impactful developments in their field.

Conclusion

Cheng-Han Yao's contributions to semiconductor packaging exemplify his dedication to innovation. His patented designs not only enhance product reliability but also reflect the importance of collaboration in technological advancements.