Chi-Chuan Wu

Title: **Innovative Contributions of Chi-Chuan Wu in Semiconductor Technology**

Introduction

Chi-Chuan Wu, based in Taichung, Taiwan, is a prominent inventor known for his significant contributions to the field of semiconductor technology. With 29 patents to his name, Wu has established himself as a thought leader in fabricating advanced semiconductor packages. His work not only enhances the efficiency of semiconductor applications but also addresses critical challenges in thermal management.

Latest Patents

Among Wu's latest innovations is the "Method for fabricating flip-chip semiconductor package with lead frame as chip carrier." This invention presents a flip-chip semiconductor package that features a lead frame serving as a chip carrier. The design includes a plurality of leads, each formed with a dam member. The method allows a chip to be mounted onto the lead frame using solder bumps. Each solder bump is positioned strategically between the dam member and the inner end of the lead.

During the reflow-soldering process, the dam members play a critical role in controlling the collapse height of the solder bumps, significantly enhancing their resistance to thermal stress caused by the coefficient of thermal expansion (CTE) mismatch between the chip and the leads. This innovation effectively prevents incomplete electrical connections, promoting reliability in semiconductor devices.

Additionally, he is credited with the invention "Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof," which shares similar foundational elements to his previous patent, further establishing his expertise in this niche.

Career Highlights

Chi-Chuan Wu is currently affiliated with Siliconware Precision Industries Co., Ltd., where he continues to expand his portfolio of inventive work. His career has been marked by the pursuit of excellence in semiconductor packaging technologies, underlining the importance of innovation in enhancing electronic devices' functionality and durability.

Collaborations

Throughout his career, Wu has collaborated with notable colleagues such as Randy H.Y. Lo and Chien-Ping Huang. These collaborations have fostered an environment of creativity and technical advancement, resulting in groundbreaking advancements in semiconductor technology that cater to the growing demands of the electronics industry.

Conclusion

Chi-Chuan Wu's innovative contributions to semiconductor technology are evident through his extensive patent portfolio. His latest inventions reflect a deep understanding of the complexities involved in chip packaging and thermal management. As technology continues to evolve, Wu's work will undoubtedly pave the way for further innovations in the semiconductor landscape, ensuring reliability and performance for future electronic devices.