The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2004
Filed:
Jul. 28, 2000
Applicant:
Inventors:
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ;
Abstract
A method of packaging a multi chip module (MCM) with low cost and high reliability is disclosed. In the MCM process, a plurality of bare chips and CPSs, such as CPU or memory device, are integrated on a substrate to increase the package density. The method discards the high cost KGD process and directly takes the thin and small CSPs passing the tests as KGD and integrates the chips and CSPs into ball grid array package (BGA package) so that the cost is reduced and the yield and quality of the package is improved.