Ssu-Cheng Lai

Title: Ssu-Cheng Lai: Innovator in Multi Chip Module Packaging

Introduction

Ssu-Cheng Lai is a notable inventor based in Tai-Chung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for multi chip modules.

Latest Patents

Ssu-Cheng Lai holds a patent for a "Method of packaging multi chip module." This method focuses on creating a multi chip module (MCM) that is both cost-effective and reliable. The process involves integrating multiple bare chips and chip scale packages (CSPs), such as CPUs or memory devices, onto a substrate to enhance package density. By eliminating the expensive known good die (KGD) process, the method utilizes thin and small CSPs that have passed testing as KGD. This integration into a ball grid array package (BGA package) not only reduces costs but also improves yield and quality.

Career Highlights

Ssu-Cheng Lai is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has contributed to advancements in packaging technology, making it more efficient and accessible.

Collaborations

He has collaborated with notable colleagues, including Randy H. Y. Lo and Chi-Chuan Wu, who have also contributed to the field of semiconductor technology.

Conclusion

Ssu-Cheng Lai's innovative approach to multi chip module packaging exemplifies the importance of cost reduction and reliability in semiconductor technology. His contributions continue to influence the industry positively.