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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12500145 B1

PDFFull Text
Date of Patent:
Dec. 16, 2025

Filed:

Jun. 26, 2023

Electronic package and manufacturing method thereof

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Min-Han Chuang, Taichung, TW;

Ho-Chuan Lin, Taichung, TW;

Chia-Chu Lai, Taichung, TW;

Assignee:

SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;

Attorney:

Studebaker Brackett PLLC

Primary Examiner:

Theresa T Doan

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H10D 1/20 (2025.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H10D 1/20 (2025.01); H01L 2221/68345 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/19042 (2013.01);
Abstract

An electronic package and a manufacturing method thereof are provided, in which a magnetically permeable member and a plurality of supporting members having conductive through vias are disposed on a carrier structure having a circuit layer, the magnetically permeable member is located between two supporting members, and a conductive member is disposed on the supporting members to cover the magnetically permeable member, so that the circuit layer, the conductive through vias and the conductive member form a coil surrounding the magnetically permeable member to increase the inductance.

Find Patent Forward Citations

Chuang, Min-Han. (2025). Electronic package and manufacturing method thereof (U.S. Patent No. 12500145). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12500145

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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