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For the Inventor, By the Inventor

Taichung, Taiwan

Ho-Chuan Lin

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 14(Granted Patents)


Location History:

  • Taichung Hsien, TW (2015)
  • Taichung, TW (2015 - 2024)

Company Filing History:

goldMedal17 out of 818 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2015-2025

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17 patents (USPTO):Explore Patents
1. 12368081 - Electronic package comprising conductive layer connected electrode pad through electronic component (2025-07-22),
2. 12334425 - Electronic package and manufacturing method thereof (2025-06-17),
3. 12293952 - Electronic package and manufacturing method thereof (2025-05-06),
4. 12100648 - Electronic module, manufacturing method thereof and electronic package having the same (2024-09-24),
5. 12100633 - Electronic package comprising wire inside an electronic component (2024-09-24),
6. 12068211 - Electronic package comprising multiple wires inside an electronic component (2024-08-20),
7. 12027753 - Electronic package and antenna structure thereof (2024-07-02),
8. 12014967 - Manufacturing method of electronic package comprising a wire within an electronic component (2024-06-18),
9. 11776897 - Electronic module, manufacturing method thereof and electronic package having the same (2023-10-03),
10. 11728234 - Electronic package comprising wire inside an electronic component and manufacturing method thereof (2023-08-15),
11. 11437325 - Electronic device, electronic package and packaging substrate thereof (2022-09-06),
12. 9698090 - Semiconductor substrate and fabrication method thereof (2017-07-04),
13. 9503043 - Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer (2016-11-22),
14. 9281557 - Multi bandwidth balun and circuit structure thereof (2016-03-08),
15. 9196941 - Cross-coupled bandpass filter (2015-11-24),

Title: Ho-Chuan Lin: Innovator in Electronic Packaging

Introduction

Ho-Chuan Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 17 patents. His work focuses on improving the efficiency and performance of electronic components through innovative designs.

Latest Patents

Among his latest patents is an electronic package comprising a conductive layer connected to an electrode pad through an electronic component. This invention features an electronic component embedded in an encapsulant, with at least one electrode pad on its active surface. A wire is electrically connected to the electrode pad, allowing the conductive layer to serve as a power transmission structure, reducing DC resistance and improving impedance issues associated with power supply. Another notable patent is for an electronic package and its manufacturing method, which includes a mesh structure between a circuit structure and an electronic element. This design enhances the shunt path of current, reducing power loss and ensuring that the IR drop of the electronic element meets required standards.

Career Highlights

Ho-Chuan Lin is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative solutions in electronic packaging. His expertise and dedication to his work have positioned him as a key figure in the industry.

Collaborations

He has collaborated with notable coworkers, including Chia-Chu Lai and Min-Han Chuang, contributing to various projects that advance the field of electronic packaging.

Conclusion

Ho-Chuan Lin's contributions to electronic packaging through his patents and innovative designs have significantly impacted the industry. His work continues to pave the way for advancements in technology and efficiency in electronic components.

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