Ho-Chuan Lin

This inventor holds 19 USPTO granted patents and 10 published patent applications, primarily in Electronic Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ho-Chuan Lin. Retrieved from https://idiyas.com/inventor/ho-chuan-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 19 (Patent Applications = 10)

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 15(Granted Patents)

Location History:

Taichung Hsien, TW (2015)
Taichung, TW (2015 - 2024)

Company Filing History:

19 out of 826

Siliconware Precision Industries Co., Ltd.

patents

Years Active: 2015-2026

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Areas of Expertise:

Electronic Package

Manufacturing Method

Conductive Layer

RF Transceiver

Antenna Structure

Semiconductor Substrate

Duplexer

Multi Bandwidth Balun

Cross-Coupled Filter

Circuit Structure

Electronic Module

Packaging Substrate

19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12526912 - Carrier structure (2026-01-13),

2. 12500145 - Electronic package and manufacturing method thereof (2025-12-16),

3. 12368081 - Electronic package comprising conductive layer connected electrode pad through electronic component (2025-07-22),

4. 12334425 - Electronic package and manufacturing method thereof (2025-06-17),

5. 12293952 - Electronic package and manufacturing method thereof (2025-05-06),

6. 12100648 - Electronic module, manufacturing method thereof and electronic package having the same (2024-09-24),

7. 12100633 - Electronic package comprising wire inside an electronic component (2024-09-24),

8. 12068211 - Electronic package comprising multiple wires inside an electronic component (2024-08-20),

9. 12027753 - Electronic package and antenna structure thereof (2024-07-02),

10. 12014967 - Manufacturing method of electronic package comprising a wire within an electronic component (2024-06-18),

11. 11776897 - Electronic module, manufacturing method thereof and electronic package having the same (2023-10-03),

12. 11728234 - Electronic package comprising wire inside an electronic component and manufacturing method thereof (2023-08-15),

13. 11437325 - Electronic device, electronic package and packaging substrate thereof (2022-09-06),

14. 9698090 - Semiconductor substrate and fabrication method thereof (2017-07-04),

15. 9503043 - Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer (2016-11-22),

Title: Ho-Chuan Lin: Innovator in Electronic Packaging

Introduction

Ho-Chuan Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 17 patents. His work focuses on improving the efficiency and performance of electronic components through innovative designs.

Latest Patents

Among his latest patents is an electronic package comprising a conductive layer connected to an electrode pad through an electronic component. This invention features an electronic component embedded in an encapsulant, with at least one electrode pad on its active surface. A wire is electrically connected to the electrode pad, allowing the conductive layer to serve as a power transmission structure, reducing DC resistance and improving impedance issues associated with power supply. Another notable patent is for an electronic package and its manufacturing method, which includes a mesh structure between a circuit structure and an electronic element. This design enhances the shunt path of current, reducing power loss and ensuring that the IR drop of the electronic element meets required standards.

Career Highlights

Ho-Chuan Lin is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative solutions in electronic packaging. His expertise and dedication to his work have positioned him as a key figure in the industry.

Collaborations

He has collaborated with notable coworkers, including Chia-Chu Lai and Min-Han Chuang, contributing to various projects that advance the field of electronic packaging.

Conclusion

Ho-Chuan Lin's contributions to electronic packaging through his patents and innovative designs have significantly impacted the industry. His work continues to pave the way for advancements in technology and efficiency in electronic components.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

10 patents pending: