Taichung, Taiwan

Min-Han Chuang

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 14(Granted Patents)


Location History:

  • Taichung Hsien, TW (2015)
  • Taichung, TW (2015 - 2024)

Company Filing History:


Years Active: 2015-2025

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15 patents (USPTO):Explore Patents

Title: Min-Han Chuang: Innovator in Electronic Packaging

Introduction

Min-Han Chuang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 15 patents. His work focuses on improving power transmission structures and reducing power loss in electronic components.

Latest Patents

Chuang's latest patents include innovative designs for electronic packages. One notable patent describes an electronic package comprising a conductive layer connected to an electrode pad through an electronic component. This design allows for a current path that reduces DC resistance and addresses impedance issues associated with power supply. Another patent outlines a manufacturing method for an electronic package that incorporates a mesh structure between a circuit structure and an electronic element. This mesh structure enhances the shunt path of current, thereby minimizing power loss and ensuring that the IR drop of the electronic element meets required standards.

Career Highlights

Min-Han Chuang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has positioned him as a key player in the development of advanced electronic packaging solutions. His innovative approaches have garnered attention in the industry and contributed to the company's reputation for excellence.

Collaborations

Chuang has collaborated with notable colleagues, including Chia-Chu Lai and Ho-Chuan Lin. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the advancement of technology in electronic packaging.

Conclusion

Min-Han Chuang's contributions to electronic packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the field and a dedication to finding effective solutions. Through his work, he continues to influence the future of electronic components and packaging technology.

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