This inventor holds 32 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 1999-2011.
Location History:
- Hsingchu, TW (1999)
- Hsintsu Hsien, TW (2001 - 2002)
- Hsinchu Hsien, TW (2000 - 2004)
- Taichung, TW (2005 - 2007)
- Hsinchu, TW (2002 - 2011)
Company Filing History:
Years Active: 1999-2011
Areas of Expertise:
Title: The Innovative Contributions of Chien Ping Huang
Introduction: Chien Ping Huang, a prominent inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor packaging. With an impressive portfolio consisting of 32 patents, Huang continues to advance technology through innovative methods that enhance the efficiency and effectiveness of electronic components.
Latest Patents: Among his latest patents, Huang has developed a unique method for fabricating semiconductor packages free of substrates. This innovative approach utilizes a dielectric material layer with multiple openings, where solder material is precisely applied. Subsequently, a first copper layer and a second copper layer are deposited onto this structure and patterned to create conductive traces. Each trace is equipped with a metal-coated terminal. The chip is then mounted on these traces, establishing electrical connections through bonding wires while leaving the dielectric material layer and solder materials exposed. This design not only flexibly arranges the conductive traces but also shortens the bonding wires, leading to improved trace routability and enhanced electrical connections.
Career Highlights: Chien Ping Huang's career is marked by his tenure at Siliconware Precision Industries Co., Ltd., where he has been instrumental in driving innovation. His expertise in semiconductor packaging has earned him recognition and respect within the industry, contributing to the company’s advancements in technology.
Collaborations: Huang has collaborated with notable colleagues such as Han-Ping Pu and Chih-Ming Huang, working together to push the boundaries of semiconductor packaging technology. These collaborations have led to significant innovations and improved methodologies in the field.
Conclusion: Chien Ping Huang's work exemplifies the spirit of innovation in semiconductor technology. His extensive patent portfolio and collaborative efforts continue to shape the future of electronics, ensuring better performance and reliability in semiconductor applications. Huang's contributions are a testament to the impact of dedicated inventors in advancing technology and improving industry standards.