The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
May. 09, 2005
Applicants:
Han-ping Pu, Taichung, TW;
Chien Ping Huang, Taichung, TW;
Inventors:
Han-Ping Pu, Taichung, TW;
Chien Ping Huang, Taichung, TW;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package without bonding wires and a fabrication method are provided. The semiconductor package includes a substrate having a front surface and a back surface, two chips formed on the front surface, two dielectric layers formed on the chips respectively, two conductive trace layers formed on the dielectric layers respectively, an insulating layer formed on one of the dielectric layers, and a plurality of solder balls implanted on the back surface of the substrate. One of the dielectric layers is formed on one of the chips and attached to an entire non-active surface of the other of the chips.