The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2006
Filed:
Mar. 29, 2001
Chien Ping Huang, Hsinchu, TW;
Tzong Da Ho, Taichung, TW;
Isaac Yu, Taichung, TW;
Abstract
A substrate strip with warpage-preventive linkage structure is proposed for a BGA (Ball Grid Array) application. The proposed substrate strip is composed of a series of substrates, each being used for the construction of an individual unit of a BGA package, and which is characterized by the provision of a warpage-preventive linkage structure, by which each substrate on the substrate strip is supported by means of no more than two tie bars, i.e., either by a two-point linkage structure or a one-point linkage structure, in contrast to the four-point linkage structure utilized by the prior art. During high-temperature fabrication steps when the substrate is subjected to thermal stresses, the substrate can freely expand toward the corners where no tie bars are provided; and consequently, it can be unwarped by the thermal stresses. This unwarped substrate allows the subsequently implanted ball grid array thereon to have high coplanarity.