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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12451416 B1

PDFFull Text
Date of Patent:
Oct. 21, 2025

Filed:

May. 02, 2023

Electronic package and manufacturing method thereof

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Jun-Hao Feng, Taichung, TW;

You-Chen Lin, Taichung, TW;

Assignee:

SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;

Attorney:

Studebaker Brackett PLLC

Primary Examiner:

Stanley Tso

Assistant Examiner:

Sidi M Maiga

Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H05K 1/119 (2013.01); H05K 3/4602 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10522 (2013.01);
Abstract

An electronic package is provided, in which a conductive structure and a reinforced insulation portion are bonded to a dielectric layer, and the reinforced insulation portion is in contact with and abuts against the conductive structure, such that the reinforced insulation portion can support the conductive structure to prevent the conductive structure from cracking when an electronic structure is disposed on the dielectric layer and electrically connected to the conductive structure.

Find Patent Forward Citations

Feng, Jun-Hao. (2025). Electronic package and manufacturing method thereof (U.S. Patent No. 12451416). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12451416

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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