The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Feb. 15, 2019
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Yangming Liu, Shanghai, CN;

Ning Ye, San Jose, CA (US);

Chin-Tien Chiu, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/32 (2013.01); H01L 23/562 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01);
Abstract

A semiconductor device is disclosed having reinforced supports at corners of the device. The semiconductor device may include solder balls on a lower surface of the device for soldering the device onto a printed circuit board. In one example, the solder balls at the corners of the semiconductor device may be replaced by support billets having more mass and more contact area between the semiconductor device and the PCB. In a further example, screws may be provided at the corners of the device (instead of the corner solder balls or in addition to the corner solder balls). These screws may be placed through the corners of the semiconductor device and into the printed circuit board.


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