The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Mar. 13, 2020
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06586 (2013.01);
Abstract
A semiconductor device is disclosed including one or more stacks of semiconductor dies vertically molded together in an encapsulated block. The semiconductor dies may comprise memory dies, or memory dies and a controller die.
Quick Actions:
Yang, Xuyi. (2022). Semiconductor device including vertically stacked semiconductor dies (U.S. Patent No. 11302673). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11302673
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile