The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Feb. 28, 2018
Sandisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
Junrong Yan, Shanghai, CN;
Xiaofeng Di, Shanghai, CN;
Harjashan Singh, New York, NY (US);
Gokul Kumar, San Jose, CA (US);
Chee Keong Chin, Shanghai, CN;
Ming Xia Wu, Shanghai, CN;
Jian Bin Gu, Shanghai, CN;
SanDisk Semiconductor (Shanghai) Co. Ltd., Shanghai, CN;
Abstract
A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.