Company Filing History:
Years Active: 2019
Title: Harjashan Singh: Innovator in Semiconductor Technology
Introduction
Harjashan Singh is a notable inventor based in New York, NY (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances the efficiency of electronic components.
Latest Patents
Harjashan Singh holds a patent for a semiconductor device that includes a dual pad wire bond interconnection. This device features a semiconductor die with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads are electrically connected to the integrated circuits within the semiconductor die. The dummy die bond pads are strategically placed in the scribe area of a semiconductor wafer, serving the purpose of wire bonding the semiconductor die within the device. He has 1 patent to his name.
Career Highlights
Harjashan Singh is currently employed at Sandisk Semiconductor (Shanghai) Co. Ltd. His role at the company allows him to work on cutting-edge semiconductor technologies. His expertise in this field has positioned him as a valuable asset to his team.
Collaborations
Throughout his career, Harjashan has collaborated with talented individuals such as Junrong Yan and Xiaofeng Di. These collaborations have contributed to the advancement of semiconductor innovations.
Conclusion
Harjashan Singh's contributions to semiconductor technology exemplify his dedication to innovation. His patent and work at Sandisk Semiconductor highlight his role as a key player in the industry.