Western Digital Technologies, Inc.

Sandisk Semiconductor (shanghai) Co. Ltd.

Xiaofeng Di

Junrong Yan

Chee Keong Chin

Chin-Tien Chiu

Cong Zhang

Gokul Kumar

Weili Wang

Kim Lee Bock

Xin Lu

Ming Wu

Zhonghua Qian

Yang Lei

Qi Deng

Jian Bin Gu

Mingxia Wu

CheeKeong Chin

Chenlin Yang

Yuyun Lou

Harjashan Singh

Chaur Yang Ng

A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.

Wire bonding for semiconductor devices

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Semiconductor device including vertical wire bonds

A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.

Semiconductor device including dual pad wire bond interconnection

A semiconductor device is disclosed including semiconductor die stacked in a stepped, offset configuration, where die bond pads of semiconductor die on different levels are interconnected using one or more conductive bumps.

Semiconductor device including conductive bump interconnections

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Shanghai, China

Xiaofeng Di