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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12083715 B1

PDFFull Text
Date of Patent:
Sep. 10, 2024

Filed:

Dec. 02, 2021

Mold compound dispensing system and method

Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Xianlu Cui, Shanghai, CN;

Junrong Yan, Shanghai, CN;

C K Chin, Shanghai, CN;

Tao Shi, Shanghai, CN;

Assignee:

Morgan, Lewis & Bockius LLP, San Jose, CA (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Charles R Kasenge

Int. Cl.
CPC ...
B29C 43/58 (2006.01); B29C 41/18 (2006.01); B29C 43/18 (2006.01); G05B 19/4097 (2006.01); H01L 21/56 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
B29C 43/58 (2013.01); B29C 43/18 (2013.01); G05B 19/4097 (2013.01); H01L 21/561 (2013.01); B29C 2043/182 (2013.01); B29C 2043/5825 (2013.01); B29K 2063/00 (2013.01); B29L 2031/34 (2013.01); G05B 2219/45031 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01);
Abstract

A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.

Find Patent Forward Citations

Cui, Xianlu. (2024). Mold compound dispensing system and method (U.S. Patent No. 12083715). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12083715

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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