The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Jun. 22, 2017
Sandisk Semiconductor (Shanghai) Co., Ltd., Shanghai, CN;
Junrong Yan, Shanghai, CN;
Chee Keong Chin, Shanghai, CN;
Chong Un Tan, Shanghai, CN;
Ming Xia Wu, Shanghai, CN;
Kim Lee Bock, Shanghai, CN;
Shrikar Bhagath, San Jose, CA (US);
SanDisk Semiconductor (Shanghai) Co. Ltd., Shanghai, CN;
Abstract
A semiconductor device is disclosed that is formed with die bond pads at an edge of the semiconductor die. The die bond pads may be formed partially in a kerf area between semiconductor die on a wafer. When the wafer is diced, the die bond pads are severed along their length, leaving a portion of the die bond pads exposed at an edge of the diced semiconductor die. Having die bond pads at the edge of the die minimizes the offset between die when stacked into a package.