The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Mar. 10, 2020
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Junrong Yan, Shanghai, CN;
Jianming Zhang, Shanghai, CN;
Min Zhao, Shanghai, CN;
Kailei Zhang, Shanghai, CN;
Chee Keong Chin, Shanghai, CN;
Kim Lee Bock, Shanghai, CN;
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/562 (2013.01); H01L 24/94 (2013.01);
Abstract
A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.