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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12463097 B1

PDFFull Text
Date of Patent:
Nov. 04, 2025

Filed:

Feb. 12, 2021

Semiconductor device with reduced stress die pick and place

Applicant:

Sandisk Technologies, Inc., Milpitas, CA (US);

Inventors:

Xin Tian, Shanghai, CN;

Junrong Yan, Shanghai, CN;

Chee Keong Chin, Shanghai, CN;

Weili Wang, Shanghai, CN;

Yang Lei, Shanghai, CN;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:

Pearl Cohen Zedek Latzer Baratz LLP

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/6838 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H01L 2224/2763 (2013.01); H01L 2224/83855 (2013.01);
Abstract

Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may then be supported on a vacuum chuck without using a dicing tape, and dies transferred from the wafer using a pick and place robot.

Find Patent Forward Citations

Tian, Xin. (2025). Semiconductor device with reduced stress die pick and place (U.S. Patent No. 12463097). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12463097

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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