The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Aug. 18, 2006
Applicants:

Chee Keong Chin, Butterworth, MY;

Yu Feng Feng, Shanghai, CN;

Guo Qiang Shen, Shanghai, CN;

Inventors:

Chee Keong Chin, Butterworth, MY;

Yu Feng Feng, Shanghai, CN;

Guo Qiang Shen, Shanghai, CN;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/502 (2006.01); G06K 19/07 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07 (2013.01); G06K 19/07732 (2013.01);
Abstract

An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.


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