The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Dec. 04, 2007
Chee Keong Chin, Shanghai, CN;
Chee Keong Chin, Shanghai, CN;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit package system comprises: providing a first integrated circuit die; attaching a second integrated circuit die over the first integrated circuit die and offset from the first integrated circuit die in substantially one dimension; forming an interdie layer over the second integrated circuit die; attaching a third integrated circuit die over the interdie layer and substantially aligned to the second integrated circuit die; and attaching a fourth integrated circuit die over the third integrated circuit die and offset from the third integrated circuit die in substantially the same magnitude and substantially the opposite direction as the second integrated circuit die to the first integrated circuit die.