The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Sep. 24, 2007
Applicants:
Jae Hak Yee, Shanghai, CN;
Junwoo Myung, Kyungsang-do, KR;
Byoung Wook Jang, Seoul, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the sacrificial substrate; forming conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and removing the sacrificial substrate.