Yong-In, South Korea

Byoung Wook Jang

USPTO Granted Patents = 11 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 39(Granted Patents)


Location History:

  • Seoul, KR (2010 - 2012)
  • Yong-in, KR (2011 - 2014)

Company Filing History:


Years Active: 2010-2014

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11 patents (USPTO):Explore Patents

Title: Byoung Wook Jang: Innovator in Integrated Circuit Packaging

Introduction

Byoung Wook Jang is a prominent inventor based in Yong-In, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 11 patents. His innovative designs have advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Among his latest patents is an integrated circuit package system with leads having multiple sides exposed. This system involves forming an integrated circuit stack with a bottom non-active side and a top non-active side. It connects an internal interconnect between a lead and the integrated circuit stack, while forming an encapsulation around the stack and interconnect. The design ensures that both the top and bottom sides are exposed for optimal functionality. Another notable patent is the integrated circuit package system with stacked die, which includes a trace frame with an encapsulant and bonding pads. This design allows for efficient connections between the bonding pads and enhances the overall performance of the integrated circuit.

Career Highlights

Byoung Wook Jang is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuits. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Jang has collaborated with talented individuals such as Junwoo Myung and Jae Hak Yee. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Byoung Wook Jang is a key figure in the realm of integrated circuit packaging, with a proven track record of innovation and collaboration. His contributions continue to shape the future of electronic devices, making him a notable inventor in the industry.

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