The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Nov. 18, 2008
Daesik Choi, Seoul, KR;
Deokkyung Yang, Hanam-si, KR;
Jong-woo Ha, Seoul, KR;
Byoung Wook Jang, Yong-in, KR;
Jaesick Bae, Seoul, KR;
Seung Won Kim, Ichon-si, KR;
DaeSik Choi, Seoul, KR;
DeokKyung Yang, Hanam-si, KR;
Jong-Woo Ha, Seoul, KR;
Byoung Wook Jang, Yong-in, KR;
JaeSick Bae, Seoul, KR;
Seung Won Kim, Ichon-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile