The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Mar. 25, 2009
Applicants:
Jong-woo Ha, Seoul, KR;
Daesik Choi, Seoul, KR;
Byoung Wook Jang, Yong-in, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 23/492 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a first stack layer including a first device over a first substrate, the first device including a through silicon via; configuring a second stack layer over the first stack layer, the second stack layer including an analog device; configuring a third stack layer over the second stack layer; and encapsulating the integrated circuit packaging system.
Ha, Jong-Woo. (2013). Integrated circuit packaging system with stacked configuration and method of manufacture thereof (U.S. Patent No. 8405197). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8405197
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