The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Apr. 01, 2006
Applicants:
Byoung Wook Jang, Seoul, KR;
Hun Teak Lee, Ichon, KR;
Kwang Soon Hwang, Seoul, KR;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
Jang, Byoung. (2011). Integrated circuit package system with wire bond pattern (U.S. Patent No. 7863737). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7863737
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile