Kwang Soon Hwang

Title: Kwang Soon Hwang: Innovator in Integrated Circuit Technologies

Introduction

Kwang Soon Hwang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit technologies, holding a total of 2 patents. His innovative work has advanced the capabilities of electronic devices, making them more efficient and effective.

Latest Patents

Hwang's latest patents include an inter-stacking module system and an integrated circuit package system with a wire bond pattern. The inter-stacking module system involves mounting an integrated circuit on a first substrate, which has a first bond pad. An inter-stacking module substrate is then mounted over the integrated circuit, forming an inter-stacking module bonding pad, and connecting bond wires between the two pads. The integrated circuit package system features a plurality of substantially identical package leads formed in a single row, with bond wires attached at offset locations on adjacent package leads.

Career Highlights

Kwang Soon Hwang is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative solutions in the field of integrated circuits. His work has been instrumental in enhancing the performance and reliability of electronic packaging technologies.

Collaborations

Hwang has collaborated with notable colleagues such as Hun Teak Lee and Byoung Wook Jang, contributing to various projects that push the boundaries of technology in their field.

Conclusion

Kwang Soon Hwang is a distinguished inventor whose work in integrated circuit technologies has made a lasting impact. His patents reflect his commitment to innovation and excellence in the electronics industry.