Stats Chippac Pte. Ltd.

Kwang Soon Hwang

Hun Teak Lee

Koo Hong Lee

Youngcheol Kim

Byoung Wook Jang

An inter-stacking module system is provided by mounting an integrated circuit on a first substrate, the first substrate having a first bond pad, mounting an inter-stacking module substrate over the integrated circuit, forming an inter-stacking module bonding pad on the inter-stacking module substrate, and connecting bond wires between the inter-stacking module bonding pad and the first bond pad.

Inter-stacking module system

An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.

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Seoul, South Korea

Kwang Soon Hwang