The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2011
Filed:
Apr. 11, 2008
Applicants:
Jae Hak Yee, Shanghai, CN;
Junwoo Myung, Ichon-si, KR;
Byoung Wook Jang, Yong-in, KR;
Youngchul Kim, Yongin-si, KR;
Inventors:
Jae Hak Yee, Shanghai, CN;
Junwoo Myung, Ichon-si, KR;
Byoung Wook Jang, Yong-in, KR;
YoungChul Kim, Yongin-si, KR;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.