IDiyas

For the Inventor, By the Inventor

Ichon-si, South Korea

Junwoo Myung

USPTO Granted Patents = 11

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 54(Granted Patents)


Location History:

  • Ichon-si, KR (2010 - 2014)
  • Kyungsang-do, KR (2012 - 2015)

Company Filing History:

goldMedal11 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2010-2015

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11 patents (USPTO):Explore Patents
1. 8937372 - Integrated circuit package system with molded strip protrusion (2015-01-20),
2. 8810019 - Integrated circuit package system with stacked die (2014-08-19),
3. 8710634 - Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof (2014-04-29),
4. 8501540 - Method for manufacture of inline integrated circuit system (2013-08-06),
5. 8421210 - Integrated circuit packaging system with dual side connection and method of manufacture thereof (2013-04-16),
6. 8304296 - Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof (2012-11-06),
7. 8183089 - Method for manufacturing package system incorporating flip-chip assembly (2012-05-22),
8. 8138591 - Integrated circuit package system with stacked die (2012-03-20),
9. 7968981 - Inline integrated circuit system (2011-06-28),
10. 7871861 - Stacked integrated circuit package system with intra-stack encapsulation (2011-01-18),
11. 7859120 - Package system incorporating a flip-chip assembly (2010-12-28),

Title: Innovations of Junwoo Myung

Introduction

Junwoo Myung is a prominent inventor based in Ichon-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 11 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Among his latest patents, Junwoo Myung has developed an integrated circuit package system with a molded strip protrusion. This innovative system includes an in-line strip that attaches an integrated circuit die, along with a molding material that features a molded segment with a protrusion. Another notable patent is the integrated circuit package system with stacked die, which incorporates a trace frame with an encapsulant, bonding pads, and conductive traces that connect the bonding pads in a one-to-one correspondence. This design allows for enhanced functionality and space efficiency in electronic devices.

Career Highlights

Junwoo Myung is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of integrated circuit technology. His expertise and innovative mindset have positioned him as a key player in the industry, contributing to the development of cutting-edge solutions.

Collaborations

Throughout his career, Junwoo has collaborated with talented individuals such as Byoung Wook Jang and Jae Hak Yee. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Junwoo Myung's contributions to the field of integrated circuit packaging are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of electronic technology.

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