The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Mar. 25, 2009
Heejo Chi, Daejeon-si, KR;
Jae Han Chung, Ichon-si, KR;
Junwoo Myung, Ichon-si, KR;
Yeonglm Park, Suwon, KR;
Hyungmin Lee, Bucheon-si, KR;
HeeJo Chi, Daejeon-si, KR;
Jae Han Chung, Ichon-si, KR;
Junwoo Myung, Ichon-si, KR;
Yeonglm Park, Suwon, KR;
HyungMin Lee, Bucheon-si, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate-interconnect; mounting an integrated circuit above and to the substrate; mounting an internal interconnect to the substrate-interconnect; mounting a structure having an integral-interposer-structure over the substrate and over the integrated circuit with the integral-interposer-structure connected to the internal interconnect; and encapsulating the internal interconnect and the integrated circuit with an encapsulation.