This inventor holds 2 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2014-2016.
Location History:
- Suwon, KR (2014)
- Kyoungki-do, KR (2016)
Company Filing History:
Years Active: 2014-2016
Title: Yeonglm Park: Innovator in Semiconductor Technology
Introduction
Yeonglm Park is a notable inventor based in Kyoungki-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced semiconductor devices and packaging systems.
Latest Patents
Yeonglm Park's latest patents include a semiconductor device and a method of forming a 3D semiconductor package with semiconductor die stacked over a semiconductor wafer. This innovative semiconductor device features a substrate and multiple first semiconductor die with conductive vias. The design allows for efficient electrical connections and the integration of discrete electronic components. Another patent involves an integrated circuit packaging system with an integral-interposer-structure, which enhances the manufacturing process of integrated circuits by providing a robust encapsulation method.
Career Highlights
Yeonglm Park is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His expertise in the field has led to advancements that are crucial for modern electronic devices.
Collaborations
Throughout his career, Yeonglm has collaborated with talented individuals such as HeeJo Chi and HyungMin Lee. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.
Conclusion
Yeonglm Park's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a commitment to advancing the field and improving electronic device performance.