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For the Inventor, By the Inventor

Gyeonggi-do, South Korea

HyungMin Lee

USPTO Granted Patents = 10

Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 162(Granted Patents)


Location History:

  • Bucheon-si, KR (2013 - 2014)
  • Gyeonggi-do, KR (2011 - 2016)
  • Kyoungki-do, KR (2016)

Company Filing History:

goldMedal10 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2016

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10 patents (USPTO):Explore Patents
1. 9391046 - Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer (2016-07-12),
2. 9305897 - Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate (2016-04-05),
3. 9190297 - Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures (2015-11-17),
4. 9153476 - Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die (2015-10-06),
5. 8710668 - Integrated circuit packaging system with laser hole and method of manufacture thereof (2014-04-29),
6. 8710634 - Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof (2014-04-29),
7. 8648469 - Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate (2014-02-11),
8. 8426955 - Integrated circuit packaging system with a stack package and method of manufacture thereof (2013-04-23),
9. 8357564 - Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die (2013-01-22),
10. 8008121 - Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate (2011-08-30),

Title: Innovations of HyungMin Lee in Semiconductor Technology

Introduction

HyungMin Lee, an accomplished inventor based in Gyeonggi-do, South Korea, has made significant contributions to the field of semiconductor technology. With a total of 10 patents to his name, he has been a pivotal figure in developing advanced semiconductor devices and packages. His innovative work has not only advanced the field but has also had practical applications in various electronic systems.

Latest Patents

HyungMin Lee’s recent patents showcase his expertise in creating sophisticated semiconductor structures. One of his notable inventions includes a semiconductor device and method of forming a 3D semiconductor package with semiconductor die stacked over a semiconductor wafer. This invention involves a substrate and multiple first semiconductor dies equipped with conductive vias, enhancing the performance and efficiency of electronic systems. Additionally, he developed a semiconductor package method that mounts semiconductor dies to opposite sides of a through-silicon via (TSV) substrate, allowing for more effective stacking and integration of semiconductor devices within compact spaces.

Career Highlights

Lee's engineering acumen is further reflected in his role at Stats Chippac Pte. Ltd., a company known for its innovative solutions in semiconductor packaging. His contributions have elevated the company’s reputation in the high-tech industry, making him a valuable asset in the sphere of semiconductor advancements.

Collaborations

Throughout his career, HyungMin Lee has collaborated with distinguished colleagues such as HeeJo Chi and YeongIm Park. Together, their teamwork has led to groundbreaking developments in the semiconductor field, fostering a rich environment of innovation and shared expertise.

Conclusion

In conclusion, HyungMin Lee stands out as a leading inventor with significant contributions to semiconductor technology. His impressive portfolio of patents reflects his dedication to innovation and his impact on the industry. Through his work at Stats Chippac Pte. Ltd. and collaborations with other skilled professionals, Lee continues to advance the frontiers of semiconductor design and functionality, making him a key player in the evolution of modern electronics.

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