The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2011
Filed:
Jun. 25, 2008
Applicants:
Sungmin Song, Inchon, KR;
Junwoo Myung, Ichon-si, KR;
Byoung Wook Jang, Yong-in, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect over the first carrier and the first integrated circuit; and forming an intra-stack encapsulation between the first carrier and the second carrier surrounding the intra-stack interconnect.
Song, Sungmin. (2011). Stacked integrated circuit package system with intra-stack encapsulation (U.S. Patent No. 7871861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7871861
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile