The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Mar. 06, 2008
Applicants:
Jae Hak Yee, Shanghai, CN;
Frederick Cruz Santos, Shanghai, CN;
Yong Yong Xia, Shanghai, CN;
Jun Jie Xu, Shanghai, CN;
Inventors:
Jae Hak Yee, Shanghai, CN;
Frederick Cruz Santos, Shanghai, CN;
Yong Yong Xia, Shanghai, CN;
Jun Jie Xu, Shanghai, CN;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.