The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Aug. 04, 2006
Applicants:
Koo Hong Lee, Seoul, KR;
Jae Hak Yee, Singapore, SG;
Inventors:
Koo Hong Lee, Seoul, KR;
Jae Hak Yee, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stackable multi-chip package system is provided including forming a first external interconnect having a first through hole and a second external interconnect having a second through hole, forming a first package subassembly having the first external interconnect and a first integrated circuit die, forming a second package subassembly having the second external interconnect and a second integrated circuit die, mounting the second package subassembly over the first package subassembly, and molding the first package subassembly and the second package subassembly.