The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Feb. 21, 2007
Applicants:
Young Cheol Kim, Yongin-si, KR;
Koo Hong Lee, Seoul, KR;
Inventors:
Young Cheol Kim, Yongin-si, KR;
Koo Hong Lee, Seoul, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 23/52 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first bonding lands adjacent the single edge, connecting the die pads and the first bonding lands, and encapsulating the die pads and a portion of the first bonding lands to form a first package.