The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2013
Filed:
May. 20, 2011
Youngcheol Kim, Young In-si, KR;
Myung Kil Lee, Seoul, KR;
Gwang Kim, Ichon-si, KR;
Koo Hong Lee, Seoul, KR;
Youngcheol Kim, Young In-si, KR;
Myung Kil Lee, Seoul, KR;
Gwang Kim, Ichon-si, KR;
Koo Hong Lee, Seoul, KR;
STATS Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.