Seoul, South Korea

Myung Kil Lee


Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2007-2014

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7 patents (USPTO):Explore Patents

Title: Myung Kil Lee: Innovator in Integrated Circuit Packaging

Introduction

Myung Kil Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 7 patents. His innovative approaches have advanced the technology used in electronic devices, making them more efficient and compact.

Latest Patents

One of his latest patents is an "Integrated circuit packaging system with package-in-package and method of manufacture thereof." This invention involves a method of manufacturing an integrated circuit packaging system that includes providing a package substrate, mounting integrated circuit dies, and forming a stacked package body. Another notable patent is the "Thin package system with external terminals and method of manufacture thereof." This patent outlines a method for creating a thin package system that includes forming external bond fingers and attaching a die to land pad terminals.

Career Highlights

Myung Kil Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuit technology. His work has been instrumental in developing advanced packaging solutions that enhance the performance of electronic components.

Collaborations

Throughout his career, Myung Kil Lee has collaborated with notable colleagues, including Koo Hong Lee and Jong-Woo Ha. These partnerships have fostered a creative environment that has led to groundbreaking advancements in integrated circuit packaging.

Conclusion

Myung Kil Lee's contributions to integrated circuit packaging have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to shape the future of electronic technology.

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