Stats Chippac Pte. Ltd.

Myung Kil Lee

Koo Hong Lee

Jong-Woo Ha

Hyun Uk Kim

Gwang Kim

Youngcheol Kim

Taebok Jung

YoungChul Kim

Hyunil Bae

Jae Chang Kim

Byung Ok Kim, Legal Representative

A method of manufacture of an integrated circuit packaging system includes: providing a package substrate, having a component side and a system side; mounting a first integrated circuit die on the component side of the package substrate; mounting a second integrated circuit die on the component side of the package substrate; mounting an internal package, having an internal die, over the first integrated circuit die; coupling chip interconnects between the first integrated circuit die, the second integrated circuit die, the internal die, the component side, or a combination thereof, and forming a stacked package body by encapsulating the component side, the first integrated circuit die, the second integrated circuit die, the internal package, and the chip interconnects.

Integrated circuit packaging system with package-in-package and method of manufacture thereof

A method of manufacture of a thin package system with external terminals includes: providing a leadframe; providing a template for defining an external bond finger; forming external bond fingers in the template on the leadframe; forming land pad terminals by a first multi-layer plating; providing a die; attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe; covering an encapsulant over at least portions of the die and the external bond fingers; and removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.

Thin package system with external terminals and method of manufacture thereof

An integrated circuit package system is provided in which an interposer of predetermined thickness including a central cavity is formed. Additionally, one or more contacts are formed around the central cavity on the interposer. The interposer is employed for connecting first and second packages.

Integrated circuit package system using interposer

An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package.

Integrated circuit package system with internal stacking module adhesive

A thin package system with external terminals and a leadframe is provided. An external bond finger defining template is provided and used to form external bond fingers on the leadframe. A die is provided and attached to the leadframe. At least portions of the die and the external bond fingers are encapsulated, and the leadframe is removed.

Thin package system with external terminals

A stacked die package system including forming a bottom package including a bottom substrate and a bottom die mounted and electrically connected under the bottom substrate and forming a top package including a top substrate and a top die mounted and electrically connected over the top substrate. Mounting the top package by the top substrate over the bottom substrate and electrically connecting the bottom and top substrates. Mounting system electrical connectors under the bottom substrate adjacent the bottom die.

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Seoul, South Korea

Myung Kil Lee