logo

For the Inventor, By the Inventor

Kyungkido, South Korea

Gwang Kim

USPTO Granted Patents = 16 

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 104(Granted Patents)


Location History:

  • Kyoungki-do, KR (2009 - 2012)
  • Ichon si KyungKi-Do, KR (2012)
  • Ichon-si, KR (2008 - 2015)
  • Kyungki-Do, KR (2012 - 2017)
  • Gyeongi-do, KR (2024)

Company Filing History:

goldMedal16 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2008-2025

Loading Chart...
16 patents (USPTO):Explore Patents
1. 12374559 - Double-sided partial molded SiP module (2025-07-29),
2. 12211803 - Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation (2025-01-28),
3. 11894314 - Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulation (2024-02-06),
4. 11887863 - Double-sided partial molded SIP module (2024-01-30),
5. 9704857 - Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate (2017-07-11),
6. 9190340 - Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package (2015-11-17),
7. 9082638 - Semiconductor device with cross-talk isolation using M-cap (2015-07-14),
8. 8896115 - Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure (2014-11-25),
9. 8481371 - Thin package system with external terminals and method of manufacture thereof (2013-07-09),
10. 8349648 - Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate (2013-01-08),
11. 8269308 - Semiconductor device with cross-talk isolation using M-cap and method thereof (2012-09-18),
12. 8183130 - Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure (2012-05-22),
13. 8125076 - Semiconductor package system with substrate heat sink (2012-02-28),
14. 7947535 - Thin package system with external terminals (2011-05-24),
15. 7498667 - Stacked integrated circuit package-in-package system (2009-03-03),

Title: Gwang Kim: Pioneering Innovations in Semiconductor Technology

Introduction

Gwang Kim, an accomplished inventor based in Kyungkido, South Korea, holds an impressive portfolio of 15 patents. His contributions to the field of semiconductor technology have positioned him as a key figure in innovation, particularly in the development of methods and devices that enhance communication and efficiency in electronic systems.

Latest Patents

Among Gwang Kim's latest innovations is a groundbreaking patent for a semiconductor device and method for forming a semiconductor package featuring an RF antenna interposer encapsulated with high dielectric material. This inventive device consists of a substrate with an electrical component situated on its surface. An antenna interposer is strategically placed over the substrate, encapsulated by a first encapsulant with a high dielectric constant. The design includes a conductive layer for antenna functionality and an insulating layer with a low dielectric constant, enhancing performance and efficiency. A second encapsulant with low dielectric characteristics is also utilized, alongside a shielding layer, to ensure optimal operation of the electrical components.

Career Highlights

Gwang Kim is associated with Stats Chippac Pte. Ltd., a respected company in the semiconductor industry. His work is characterized by a commitment to advancing semiconductor packaging technologies, demonstrating his expertise in both ideation and execution of complex electronic design.

Collaborations

Collaboration plays a vital role in Gwang Kim's career. He has worked alongside esteemed colleagues, including YongTaek Lee and ByungHoon Ahn, who share a vision of pushing the boundaries of innovation within the semiconductor domain. Their collective expertise strengthens the impact of their contributions to the industry.

Conclusion

Gwang Kim stands out as a significant contributor to the semiconductor sector, leveraging his patent portfolio to drive forward-thinking solutions that address modern electronic challenges. His innovative approach and collaborative spirit not only enhance product functionality but also inspire future advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…