The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Nov. 10, 2005
Applicants:
Gwang Kim, Kyoungki-do, KR;
Koo Hong Lee, Seoul, KR;
Inventors:
Gwang Kim, Kyoungki-do, KR;
Koo Hong Lee, Seoul, KR;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package system is provided including: providing a substrate having substrate wiring and a cavity provided therein with a heat sink foil closing off the cavity; attaching a semiconductor die in the cavity to the heat sink foil; and bonding the semiconductor die to the substrate wiring.
Kim, Gwang. (2012). Semiconductor package system with substrate heat sink (U.S. Patent No. 8125076). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8125076
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile