Location History:
- Gyeong-do, KR (2008)
- Ichon-si, KR (2010 - 2012)
- Namyangju, KR (2010 - 2014)
Company Filing History:
Years Active: 2008-2014
Title: The Innovative Contributions of Hyun Joung Kim
Introduction
Hyun Joung Kim is a notable inventor based in Ichon-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 6 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.
Latest Patents
Among his latest patents, Kim has developed an integrated circuit package system with an offset stack. This innovative system includes the mounting of a first integrated circuit device over a carrier, followed by the mounting of a second integrated circuit device with an adhesive spacer in an offset configuration. The design connects internal interconnects between the carrier and both integrated circuit devices, encapsulating them for protection. Another notable patent is the integrated circuit package system that includes honeycomb molding. This method of manufacture involves providing a substrate with a top surface configured with electrical contacts, attaching an integrated circuit, and depositing a material to prevent warpage, ensuring the integrity of the device.
Career Highlights
Hyun Joung Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuit packaging. His expertise and dedication have positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.
Collaborations
Throughout his career, Kim has collaborated with talented individuals such as Taeg Ki Lim and Jong Wook Ju. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Hyun Joung Kim's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in electronic device manufacturing, and his work continues to influence the industry positively.