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Ichon-si, South Korea

Hyun Joung Kim

USPTO Granted Patents = 6

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 37(Granted Patents)

Location History:

Gyeong-do, KR (2008)
Ichon-si, KR (2010 - 2012)
Namyangju, KR (2010 - 2014)

Company Filing History:

Stats Chippac Pte. Ltd.

Years Active: 2008-2014

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8659175 - Integrated circuit package system with offset stack (2014-02-25),

2. 8217501 - Integrated circuit package system including honeycomb molding (2012-07-10),

3. 7737539 - Integrated circuit package system including honeycomb molding (2010-06-15),

4. 7687920 - Integrated circuit package-on-package system with central bond wires (2010-03-30),

5. 7656017 - Integrated circuit package system with thermo-mechanical interlocking substrates (2010-02-02),

6. 7443037 - Stacked integrated circuit package system with connection protection (2008-10-28),

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