The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2011
Filed:
Apr. 30, 2009
Hyeog Chan Kwon, Seoul, KR;
Hyeog Chan Kwon, Seoul, KR;
STATS Chippac Ltd., Singapore, SG;
Abstract
Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the other, such that the two die are situated side-by-side in the space between the two substrates. Also, multipackage modules include stacked packages, each having the die asymmetrically arranged on the substrate. Adjacent stacked packages have complementary asymmetrical arrangements of the die, and one package is inverted with respect to the other in the stack, such that the two die are situated side-by-side in the space between the two substrates. Also, methods are disclosed for making the packages and for making the stacked package modules.