The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Sep. 22, 2008
Soo-san Park, Seoul, KR;
Hyeog Chan Kwon, Seoul, KR;
Sang-ho Lee, Yeoju, KR;
Jong-woo Ha, Seoul, KR;
Soo-San Park, Seoul, KR;
Hyeog Chan Kwon, Seoul, KR;
Sang-Ho Lee, Yeoju, KR;
Jong-Woo Ha, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile