The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Apr. 01, 2006
Applicants:
Seung Wook Park, Seoul, KR;
Jong Wook Ju, Bubaleub Icheon, KR;
Inventors:
Seung Wook Park, Seoul, KR;
Jong Wook Ju, Bubaleub Icheon, KR;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A hybrid stacking package system is provided including providing a board-on-chip substrate, having an opening, attaching a first integrated circuit on the board-on-chip substrate, attaching bond wires, between the first integrated circuit and the board-on-chip substrate, through the opening, and mounting a second integrated circuit over the bond wires.